PHOTOSETTING AND THERMOSETTING RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a liquid photosetting and thermosetting resin composition giving an excellent cured film which sufficiently satisfies such properties as adhesion, heat resistance, electroless plating resistance, electric properties and PCT resistance and ensuring such working proper...

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Bibliographische Detailangaben
Hauptverfasser:	YODA KYOICHI, IWASA AIKO, NITA KAN, INAGAKI HITOSHI, NAGANO MIGAKU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a liquid photosetting and thermosetting resin composition giving an excellent cured film which sufficiently satisfies such properties as adhesion, heat resistance, electroless plating resistance, electric properties and PCT resistance and ensuring such working properties as excellent suitability to set to touch and developability. SOLUTION: The photosetting and thermosetting resin composition comprises (A) a carboxylic photosensitive resin obtained by reacting the reaction product of an epoxy compound (a) having two or more epoxy groups in one molecule and an unsaturated group-containing monocarboxylic acid (b) with a polybasic acid anhydride (c), (B) a carboxylic photosensitive resin obtained by reacting the reaction product of a novolak type phenolic resin (d) and an alkylene oxide (e) with the unsaturated group-containing monocarboxylic acid (b) and reacting the resulting reaction product with the polybasic acid anhydride (c), (C) a photopolymerization initiator, (D) a photosensitive (meth)acrylate compound, (E) an epoxy compound and (F) a diluting solvent. Preferably the composition further comprises (G) a curing catalyst. COPYRIGHT: (C)2004,JPO