FLAME-RETARDANT PHOTOCURABLE AND HEAT-CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a halogen-free, flame-retardant, photocurable and heat- curable resin composition hardly generating hydrogen bromide which is a noxious gas at burning, and providing a cured coated film having not only excellent flame retardancy but also excellent adhesion, heat resi...

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Bibliographische Detailangaben
Hauptverfasser:	YODA KYOICHI, IWASA AIKO, NITA KAN, INAGAKI HITOSHI, NAGANO MIGAKU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a halogen-free, flame-retardant, photocurable and heat- curable resin composition hardly generating hydrogen bromide which is a noxious gas at burning, and providing a cured coated film having not only excellent flame retardancy but also excellent adhesion, heat resistance, resistance to moisture absorption, PC resistance, resistance to electroless gold plating, electric insulation or the like. SOLUTION: The composition comprises (A) a carboxy group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a photosensitive (meth)acrylate compound, (D) an epoxy compound, (E) a diluting solvent and (F) an organophosphorus compound. The carboxy group-containing photosensitive resin (A) is obtained by reacting (c) an unsaturated group-containing monocarboxylic acid with a reaction product of (a) a novolak-type phenol resin with (b) an alkylene oxide, and reacting the reaction product with (d) a polybasic acid anhydride. The organophosphorus compound (F) is obtained by reacting an organophosphorus compound having one active hydrogen bonded to the phosphorus atom, with a quinone compound. COPYRIGHT: (C)2004,JPO