METHOD OF EXTRACTING WORK FROM WIRE SAW
PROBLEM TO BE SOLVED: To offer simple construction permitting the extraction of a work cut by a wire group of a wire saw from the wire group without giving significantly poor influences to its cut surface. SOLUTION: The wire saw has the wire group 27 formed by winding cutting wires W on spaces of gu...
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| creator | TAKADA MASAAKI YOSHIOKA MASAHIDE IMADA YUKINORI |
| description | PROBLEM TO BE SOLVED: To offer simple construction permitting the extraction of a work cut by a wire group of a wire saw from the wire group without giving significantly poor influences to its cut surface. SOLUTION: The wire saw has the wire group 27 formed by winding cutting wires W on spaces of guide rollers 24A, 24B, etc., for cutting the work 28 fed to the wire group 27. The work 28 after cut is extracted from the wire group 27. Damage to the cut surface of the work resulting from residual slurry is prevented by extracting the work 28 therefrom after cut while keeping the tension of wires W higher than in cutting. COPYRIGHT: (C)2003,JPO |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003275950A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003275950A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003275950A3</originalsourceid><addsrcrecordid>eNrjZFD3dQ3x8HdR8HdTcI0ICXJ0DvH0c1cI9w_yVnAL8vdVCPcMclUIdgznYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgbGRuamlqYGjsZEKQIAIh0kLA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF EXTRACTING WORK FROM WIRE SAW</title><source>esp@cenet</source><creator>TAKADA MASAAKI ; YOSHIOKA MASAHIDE ; IMADA YUKINORI</creator><creatorcontrib>TAKADA MASAAKI ; YOSHIOKA MASAHIDE ; IMADA YUKINORI</creatorcontrib><description>PROBLEM TO BE SOLVED: To offer simple construction permitting the extraction of a work cut by a wire group of a wire saw from the wire group without giving significantly poor influences to its cut surface. SOLUTION: The wire saw has the wire group 27 formed by winding cutting wires W on spaces of guide rollers 24A, 24B, etc., for cutting the work 28 fed to the wire group 27. The work 28 after cut is extracted from the wire group 27. Damage to the cut surface of the work resulting from residual slurry is prevented by extracting the work 28 therefrom after cut while keeping the tension of wires W higher than in cutting. COPYRIGHT: (C)2003,JPO</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030930&DB=EPODOC&CC=JP&NR=2003275950A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030930&DB=EPODOC&CC=JP&NR=2003275950A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKADA MASAAKI</creatorcontrib><creatorcontrib>YOSHIOKA MASAHIDE</creatorcontrib><creatorcontrib>IMADA YUKINORI</creatorcontrib><title>METHOD OF EXTRACTING WORK FROM WIRE SAW</title><description>PROBLEM TO BE SOLVED: To offer simple construction permitting the extraction of a work cut by a wire group of a wire saw from the wire group without giving significantly poor influences to its cut surface. SOLUTION: The wire saw has the wire group 27 formed by winding cutting wires W on spaces of guide rollers 24A, 24B, etc., for cutting the work 28 fed to the wire group 27. The work 28 after cut is extracted from the wire group 27. Damage to the cut surface of the work resulting from residual slurry is prevented by extracting the work 28 therefrom after cut while keeping the tension of wires W higher than in cutting. COPYRIGHT: (C)2003,JPO</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD3dQ3x8HdR8HdTcI0ICXJ0DvH0c1cI9w_yVnAL8vdVCPcMclUIdgznYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgbGRuamlqYGjsZEKQIAIh0kLA</recordid><startdate>20030930</startdate><enddate>20030930</enddate><creator>TAKADA MASAAKI</creator><creator>YOSHIOKA MASAHIDE</creator><creator>IMADA YUKINORI</creator><scope>EVB</scope></search><sort><creationdate>20030930</creationdate><title>METHOD OF EXTRACTING WORK FROM WIRE SAW</title><author>TAKADA MASAAKI ; YOSHIOKA MASAHIDE ; IMADA YUKINORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003275950A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKADA MASAAKI</creatorcontrib><creatorcontrib>YOSHIOKA MASAHIDE</creatorcontrib><creatorcontrib>IMADA YUKINORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKADA MASAAKI</au><au>YOSHIOKA MASAHIDE</au><au>IMADA YUKINORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF EXTRACTING WORK FROM WIRE SAW</title><date>2003-09-30</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To offer simple construction permitting the extraction of a work cut by a wire group of a wire saw from the wire group without giving significantly poor influences to its cut surface. SOLUTION: The wire saw has the wire group 27 formed by winding cutting wires W on spaces of guide rollers 24A, 24B, etc., for cutting the work 28 fed to the wire group 27. The work 28 after cut is extracted from the wire group 27. Damage to the cut surface of the work resulting from residual slurry is prevented by extracting the work 28 therefrom after cut while keeping the tension of wires W higher than in cutting. COPYRIGHT: (C)2003,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | METHOD OF EXTRACTING WORK FROM WIRE SAW |
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