METHOD OF EXTRACTING WORK FROM WIRE SAW

PROBLEM TO BE SOLVED: To offer simple construction permitting the extraction of a work cut by a wire group of a wire saw from the wire group without giving significantly poor influences to its cut surface. SOLUTION: The wire saw has the wire group 27 formed by winding cutting wires W on spaces of gu...

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Bibliographische Detailangaben
Hauptverfasser:	TAKADA MASAAKI, YOSHIOKA MASAHIDE, IMADA YUKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To offer simple construction permitting the extraction of a work cut by a wire group of a wire saw from the wire group without giving significantly poor influences to its cut surface. SOLUTION: The wire saw has the wire group 27 formed by winding cutting wires W on spaces of guide rollers 24A, 24B, etc., for cutting the work 28 fed to the wire group 27. The work 28 after cut is extracted from the wire group 27. Damage to the cut surface of the work resulting from residual slurry is prevented by extracting the work 28 therefrom after cut while keeping the tension of wires W higher than in cutting. COPYRIGHT: (C)2003,JPO