REFLOW SOLDERING APPARATUS

PROBLEM TO BE SOLVED: To perform a reflow soldering without obstructing and lowering the quality and the function of a printed-wiring board and without lowering the reliability. SOLUTION: The surface temperature of blasting hole bodies 21, 34 is kept to be not lower than the dew point of flux fume b...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SAWABE HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To perform a reflow soldering without obstructing and lowering the quality and the function of a printed-wiring board and without lowering the reliability. SOLUTION: The surface temperature of blasting hole bodies 21, 34 is kept to be not lower than the dew point of flux fume by using a high thermal- resistant resin member having corrosion resistance to the flux as a material of the blasting hole bodies 21, 34 for forming gas curtain. COPYRIGHT: (C)2003,JPO