PUMP DEVICE

PROBLEM TO BE SOLVED: To provide a pump device wherein only a part to be heated selectively heated without heating a part not to be heated. SOLUTION: Among members constituting a pump, the part to be heated is composed of a member easily heated by a high frequency electromagnetic field, for example,...

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Bibliographische Detailangaben
1. Verfasser: ISHIKAWA TAKAHARU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a pump device wherein only a part to be heated selectively heated without heating a part not to be heated. SOLUTION: Among members constituting a pump, the part to be heated is composed of a member easily heated by a high frequency electromagnetic field, for example, stainless steel, and the part not to be heated is composed of a member unheatable by the high frequency electromagnetic field, for example, aluminum. Thus, only the part to be heated is selectively heated isolated from the part not to be heated by supplying the high frequency electromagnetic field to the pump through a heating coil. Thus, a screw groove spacer and a base desired for restraining deposition of a deposit of process gas are heated without heating a rotor vane, a motor, and a base board part. COPYRIGHT: (C)2003,JPO