DEVICE AND SYSTEM FOR TREATMENT SUBSTRATE

PROBLEM TO BE SOLVED: To provide a substrate treatment technique making use of a substrate treatment system comprising a plurality of treatment parts that performs different treatments by a simple constitution. SOLUTION: An in-line controller 2 controls a washing part 10 and an ashing part 20 in a s...

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1. Verfasser: OTANI MASAMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate treatment technique making use of a substrate treatment system comprising a plurality of treatment parts that performs different treatments by a simple constitution. SOLUTION: An in-line controller 2 controls a washing part 10 and an ashing part 20 in a substrate treatment device 1 by receiving an instruction from a host computer 3. Further, device information acquired from the washing part 10 and the ashing part 20 is transmitted to the host computer 3. By making the in-line controller 2 synchronously adjust the washing part 10 and the ashing part 20, the substrate treatment device 1 with the simple structure comprising the washing part 10 and the ashing part 20 can be used without reassembling an integrated software for making use of a device integrated with both the washing and ashing parts. COPYRIGHT: (C)2003,JPO