CURING COMPOSITION FOR ETCHING RESIST

CURING COMPOSITION FOR ETCHING RESIST

PROBLEM TO BE SOLVED: To provide a curing composition for an etching resist having excellent curing property and excellent transportability, etching durability, and solubility and removing property with an alkali of the cured film even at a high etching temperature, and to provide a composition part...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NIWA MAKOTO, NAGOSHI HIROYUKI, IGARASHI ICHIRO
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a curing composition for an etching resist having excellent curing property and excellent transportability, etching durability, and solubility and removing property with an alkali of the cured film even at a high etching temperature, and to provide a composition particularly useful as a backing material composition in the manufacture of a shadow mask. SOLUTION: The curing composition for an etching resist shows the maximum of tanδ (E"/E') as a ratio of the loss modulus (E") to the storage modulus (E') in the dynamic viscoelasticity of the cured product in the range from 50 to 80°C, and ≥0.4 of tan δ. COPYRIGHT: (C)2003,JPO