MULTIPLE WIRING SUBSTRATE AND ELECTRONIC COMPONENT MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide a multiple-wiring substrate which can utilize a glass epoxy resin substrate having higher thermal expansion coefficient or the like and also to provide an electronic component mounting method for accurately mounting electronic component to the same multiple-wiring substrate with the flip-chip mounting method. SOLUTION: A coupling portions 3, 3 are formed between a frame body 1 and a wiring substrate 2 or between the wiring substrates 2 and these wiring substrates 2, 2 are fixed and allocated in matrix. The coupling portions 3, 3 are formed only in the edge side (or side surface) of the column direction (vertical direction in the figure) of each wiring substrate 2 but in the edge side of the raw direction of the wiring substrate 2. The wiring substrate 2 is coupled and fixed only in the columnar direction. Moreover, even in the coupling between the wiring substrate 2 and the frame body 1, these are coupled and fixed only in the columnar direction. Since the wiring substrate 2 is coupled and fixed to the vertical frame of the U-shape frame body 1, the wiring substrates 2, 2 are reliably coupled and fixed for allocation in matrix. COPYRIGHT: (C)2003,JPO