WAFER MOUNTING SEMICONDUCTOR CHIP AND ITS PRODUCING METHOD
PROBLEM TO BE SOLVED: To provide a wafer mounting a semiconductor chip, and its producing method, in which electrostatic chuck error is suppressed by relaxing warp of the wafer surely. SOLUTION: A plurality of semiconductor chips 4, e.g. dynamic random access memories, are formed on a wafer. The sem...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a wafer mounting a semiconductor chip, and its producing method, in which electrostatic chuck error is suppressed by relaxing warp of the wafer surely. SOLUTION: A plurality of semiconductor chips 4, e.g. dynamic random access memories, are formed on a wafer. The semiconductor chips 4 are sectioned by a dicing line region 6. A silicon oxide film is formed on the wafer. Meandering grooves 8 are formed in an insulation film located in the dicing line region 6. A metal film of barrier metal, or the like, constituting a semiconductor chip is formed to also cover the surface of the meandering grooves 8. Stress of the metal film is dispersed in many directions as shown by an arrow Y. COPYRIGHT: (C)2003,JPO |
|---|