METHOD FOR PRODUCING MULTILAYER BOARD

METHOD FOR PRODUCING MULTILAYER BOARD

PROBLEM TO BE SOLVED: To provide a method for producing a multilayer board in which failure can be reduced by suppressing the effect of the temperature and warp of the multilayer board itself at the time of boring a reference guide hole thereby reducing the positional shift at the time of boring a t...

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Bibliographische Detailangaben
Hauptverfasser: TAKAMATSU SHOICHI, SHIBATA NOBUTAKA
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
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ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for producing a multilayer board in which failure can be reduced by suppressing the effect of the temperature and warp of the multilayer board itself at the time of boring a reference guide hole thereby reducing the positional shift at the time of boring a through hole and enhancing the reliability of dimensional data. SOLUTION: In the method for producing a multilayer board, effect of warp is suppressed by matching constant temperature adjustment of the multilayer board itself at the time of boring a reference guide hole and the temperature conditions at the time of boring a through hole thereby reducing the effect of temperature variation, and by linear clamping between reference guide position marks. COPYRIGHT: (C)2003,JPO