SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device which joints bump electrodes provided on a semiconductor chip to pads provided on a member to be mounted, and to provide a method of manufacturing a semiconductor device by which the occurrence of short circuits between bumps can be prevented, even if the arranging pitch of the bumps becomes narrower. SOLUTION: The semiconductor manufacturing device which forms a bump 8B on a daughter chip 2B is provided with a capillary 20A which forms the bump 8B into a prescribed shape. The device also forms a projection 21A which prevents the outward protrusion of the bump 2B from the capillary 20A at a position where the bump 8B is formed by means of the capillary 20A. COPYRIGHT: (C)2003,JPO