METHOD FOR BENDING MATERIAL TO BE PROCESSED

PROBLEM TO BE SOLVED: To provide a method for bending a material to be processed capable of permitting high-precision bending without plate thickness variations and without receiving the influence of a preceeding process and also capable of allowing the simplification of measurement. SOLUTION: The m...

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Bibliographische Detailangaben
1. Verfasser: HIRAIDE MASAHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for bending a material to be processed capable of permitting high-precision bending without plate thickness variations and without receiving the influence of a preceeding process and also capable of allowing the simplification of measurement. SOLUTION: The method for bending the material to be processed is characterized in that the material to be processed 1 is bent by mounting the material to be processed 1 on a die 6 having a V groove 61 and by pressing a bending punch 5 to the material to be processed 1. After, a plurality of guide recesses 3 which position and guide the tip end of the bending punch 5 are separated in a prescribed position on the bending baseline 2 of the material to be processed 1, bending is performed by making the material to be processed 1 abut to the inner surface of the V groove 61 of the die 6 by pressing the bending punch 5 after engaging a plurality of guides 55 arranged at the tip end of the bending punch 5 with the guide recesses 3. COPYRIGHT: (C)2003,JPO