MOUNTING DEVICE AND MOUNTING METHOD

PROBLEM TO BE SOLVED: To improve component mounting efficiency when mounting an electronic component onto a board. SOLUTION: This surface mounting device is provided with a fixed camera 15 for imaging a suction condition of a component sucked from a tape feeder 4 by a suction nozzle 14; servo mechan...

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Bibliographische Detailangaben
1. Verfasser:	NOZUE TOMOYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve component mounting efficiency when mounting an electronic component onto a board. SOLUTION: This surface mounting device is provided with a fixed camera 15 for imaging a suction condition of a component sucked from a tape feeder 4 by a suction nozzle 14; servo mechanisms 41, 42, 43 and 44 along X-axis, Y-axis, Z-axis, and R-axis, respectively; and an integrated controller 35, which correct a component mounting direction sucked by the suction nozzle 14 by use of a suction condition image from the fixed camera 15, examine interference between the suction nozzle 14 and the component E previously mounted on a printed board P, either mount the sucked component when not interfering, or suspend mounting the sucked component when interfering as a result of the interference examination, and relocate to another position of the printed board P. COPYRIGHT: (C)2003,JPO