SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an area array type semiconductor device having outer terminals existing on the bottom face of a package, and its manufacturing method, more specifically the outer terminal or a bump electrode for an electrical connection with an external device of an electronic component, e.g. a semiconductor device, or a printed wiring board in which required performance can be satisfied even if the outer terminals of the semiconductor device are arranged at finer pitches. SOLUTION: Outer terminals 104 are exposed to the surface of a semiconductor device and formed in tear drop shapes. Limitation on the machining of line and space (design of wiring pattern) in the substrate wiring of the semiconductor device is cleared and so-called mounting reliability for repeated bending test of a mounting board can be ensured. COPYRIGHT: (C)2003,JPO