METHOD OF CLEANING METALLIC SURFACE AFTER POLYIMIDE ETCHING

METHOD OF CLEANING METALLIC SURFACE AFTER POLYIMIDE ETCHING

PROBLEM TO BE SOLVED: To stably apply gold plating on exposed copper surfaces by cleaning these surfaces by wet etching of insulation layers in manufacturing suspension blanks with wiring for hard disks. SOLUTION: The method of cleaning the metallic surfaces to make the stable application of the gol...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TSURUGASAKI MASATO
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
METALLURGY
PHYSICS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To stably apply gold plating on exposed copper surfaces by cleaning these surfaces by wet etching of insulation layers in manufacturing suspension blanks with wiring for hard disks. SOLUTION: The method of cleaning the metallic surfaces to make the stable application of the gold plating for protecting the copper wiring possible by subjecting the insulation layer to plasma cleaning after wet etching thereof in a manufacturing process step for the suspension blanks with wiring for the hard disks is established. COPYRIGHT: (C)2003,JPO