AQUEOUS DISPERSION FOR CHEMICAL-MECHANICAL POLISHING OF OXIDE SURFACE, METHOD AND USE OF THE SAME

PROBLEM TO BE SOLVED: To provide a dispersion in which an oxide surface can be removed with a high rate during the chemical-mechanical polishing without leaving scratches on the surface to be polished. SOLUTION: The aqueous dispersion contains a silicon dioxide powder prepared by a thermal decomposi...

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Bibliographische Detailangaben
Hauptverfasser:	LORTZ WOLFGANG DR, WILL WERNER, PERLET GABRIELE, BATZ-SOHN CHRISTOPH DR
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS THEREOF DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INORGANIC CHEMISTRY MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-METALLIC ELEMENTS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a dispersion in which an oxide surface can be removed with a high rate during the chemical-mechanical polishing without leaving scratches on the surface to be polished. SOLUTION: The aqueous dispersion contains a silicon dioxide powder prepared by a thermal decomposition process doped with an aluminum oxide in the form of aerosol. The powder has the aluminum oxide content in an amount of 0.01-3 mass%, advantageously 0.2-1.5 mass% relative to the total amount of the powder. The dispersion has an average particle diameter of maximum 0.1 μm. COPYRIGHT: (C)2003,JPO