Pb-FREE THERMOELECTRIC MODULE DEVICE
PROBLEM TO BE SOLVED: To provide a Pb-free thermoelectric module device using Pb-free solder while having excellent reliability on thermal stress and a heat cycle. SOLUTION: A plurality of thermoelements 24 are joined between a heat- generating side substrate 22 and a heat-absorbing side substrate 2...
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| creator | TAGAMI FUMIYASU KAMIMURA NAOKI HOSODA DAISUKE |
| description | PROBLEM TO BE SOLVED: To provide a Pb-free thermoelectric module device using Pb-free solder while having excellent reliability on thermal stress and a heat cycle. SOLUTION: A plurality of thermoelements 24 are joined between a heat- generating side substrate 22 and a heat-absorbing side substrate 23 by AuSn solder 33. An LD 3 is joined with the heat-absorbing side substrate 23 by heat- absorbing side solder 32, and a package 2 is joined with the heat-generating side substrate 22 by heat-generating side solder 31. One kind selected from a group composed of InSn solder, BiSn solder and SnZn solder is used as the heat-absorbing side solder 32, and SnAgCu solder is used as the heat-generating side solder 31. COPYRIGHT: (C)2003,JPO |
| format | Patent |
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SOLUTION: A plurality of thermoelements 24 are joined between a heat- generating side substrate 22 and a heat-absorbing side substrate 23 by AuSn solder 33. An LD 3 is joined with the heat-absorbing side substrate 23 by heat- absorbing side solder 32, and a package 2 is joined with the heat-generating side substrate 22 by heat-generating side solder 31. One kind selected from a group composed of InSn solder, BiSn solder and SnZn solder is used as the heat-absorbing side solder 32, and SnAgCu solder is used as the heat-generating side solder 31. COPYRIGHT: (C)2003,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Pb-FREE THERMOELECTRIC MODULE DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T07%3A38%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAGAMI%20FUMIYASU&rft.date=2003-08-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003224308A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |