Pb-FREE THERMOELECTRIC MODULE DEVICE

PROBLEM TO BE SOLVED: To provide a Pb-free thermoelectric module device using Pb-free solder while having excellent reliability on thermal stress and a heat cycle. SOLUTION: A plurality of thermoelements 24 are joined between a heat- generating side substrate 22 and a heat-absorbing side substrate 2...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAGAMI FUMIYASU, KAMIMURA NAOKI, HOSODA DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a Pb-free thermoelectric module device using Pb-free solder while having excellent reliability on thermal stress and a heat cycle. SOLUTION: A plurality of thermoelements 24 are joined between a heat- generating side substrate 22 and a heat-absorbing side substrate 23 by AuSn solder 33. An LD 3 is joined with the heat-absorbing side substrate 23 by heat- absorbing side solder 32, and a package 2 is joined with the heat-generating side substrate 22 by heat-generating side solder 31. One kind selected from a group composed of InSn solder, BiSn solder and SnZn solder is used as the heat-absorbing side solder 32, and SnAgCu solder is used as the heat-generating side solder 31. COPYRIGHT: (C)2003,JPO