CHIP TYPE CAPACITOR AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF SOLDERING CHIP TYPE CAPACITOR TO PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To manufacture and provide a chip type laminated film capacitor provided with an external terminal consisting of solder in a comparatively easy method. SOLUTION: The chip type capacitor 100 is provided with a capacitor element 10 and a pair of external electrodes provided in bo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HASEGAWA HIDEKI, MIYAMOTO YASUHIKO, HIKINO JUNICHI, ITOI SHINSUKE
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!