CHIP TYPE CAPACITOR AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF SOLDERING CHIP TYPE CAPACITOR TO PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To manufacture and provide a chip type laminated film capacitor provided with an external terminal consisting of solder in a comparatively easy method. SOLUTION: The chip type capacitor 100 is provided with a capacitor element 10 and a pair of external electrodes provided in both right and left sides of the capacitor element 10. The capacitor element 10 is formed by laminating, in the thickness direction, a plurality of sheets of the resin thin film 14 where metal layers 12, 12' are formed on the surface and the metal layers 12, 12' on the resin thin film 14 are alternately connected electrically to one of the right and left external electrodes. A pair of external electrodes are formed with a conductive resin 30 including copper/nickel alloy and thermosetting resin and an external terminal 40 formed of the fused solder plating at the external side of the conductive resin 30. COPYRIGHT: (C)2003,JPO