PATCH BOARD FOR BORING HOLE BY DRILL ON PRINTED CIRCUIT BOARD AND METHOD OF BORING

PROBLEM TO BE SOLVED: To provide a patch board for boring holes by a drill on a printed circuit board which is excellent in handleability and can improve wall surface roughness of a hole to be bored. SOLUTION: A paper-based thermosetting resin laminate plate with a nonaqueous lubricant comprising a...

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Bibliographische Detailangaben
Hauptverfasser:	OHASHI YOSHITAKA, KATO KIKUKO
Format:	Patent
Sprache:	eng
Schlagworte:	BORING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CUTTING CUTTING-OUT ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORATING PERFORMING OPERATIONS PRINTED CIRCUITS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TRANSPORTING TURNING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a patch board for boring holes by a drill on a printed circuit board which is excellent in handleability and can improve wall surface roughness of a hole to be bored. SOLUTION: A paper-based thermosetting resin laminate plate with a nonaqueous lubricant comprising a sole substance or a mixture of a polyoxyethylene alkylene block polymer and a polyoxyethylene alkylamine is used as the patch board. The nonaqueous lubricant of the paper-based thermosetting resin laminate plate is specified to be 5 to 100 pts.wt. for the resin, and a total of the nonaqueous lubricant and a thermosetting resin in the resin laminate plate is specified to be in a range of 20 to 80 wt.%. COPYRIGHT: (C)2003,JPO