HEAT PIPE

PROBLEM TO BE SOLVED: To provide a heat pipe possible to prevent the lowering of heat conductivity by restricting decomposition and deterioration of the low-level alcohol sealed inside. SOLUTION: The inner surface of a copper pipe sealed with the low-level alcohol as a heating medium is formed with...

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Bibliographische Detailangaben
Hauptverfasser:	KODAIRA MUNEO, KUMA SHOJI, OZAKI TOSHINORI, ISAKA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MECHANICAL ENGINEERING METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat pipe possible to prevent the lowering of heat conductivity by restricting decomposition and deterioration of the low-level alcohol sealed inside. SOLUTION: The inner surface of a copper pipe sealed with the low-level alcohol as a heating medium is formed with a thin film such as a Sn plating film at 0.05-2 μm of thickness. Alternatively, the hydroxy compound at 20-2000 ppm is added to the low-level alcohol. COPYRIGHT: (C)2003,JPO