HEATER FOR SUBSTRATE OF FILM DEPOSITING APPARATUS

PROBLEM TO BE SOLVED: To provide a thin film depositing apparatus capable of eliminating degradation of adhesion caused by thermal deformation, and uniformizing the film quality and the film thickness distribution. SOLUTION: When a substrate 2 is held by a holding plate 9, each heating unit 13a is pressed from the surface of the substrate 2 to compress a tightly fitting means 14. When a center part of the substrate 2 is thermally deformed, the heating unit 13a is pressed by the tightly fitting means 14, and a contact surface 13c is tightly fitted to the substrate 2 according to the thermal deformation of the substrate 2. When the heating temperature is measured by a temperature detecting means installed on each heating unit 13a, a temperature controller adjusts the current running in each heater based on the result of measurement, and the heating temperature is controlled for each heating unit 13a. As a result, variance of the temperature distribution of the substrate 2 is controlled within a predetermined range, and the temperature distribution of the substrate 2 is adjusted in a substantially uniform manner. COPYRIGHT: (C)2003,JPO