LEAD FRAME

LEAD FRAME

PROBLEM TO BE SOLVED: To provide a lead frame which does not embrittle by hydrogen when subjected to etching and a always has a high reliable function. SOLUTION: The lead frame consists of an alloy containing, by mass, 30 to 48% Ni, 0.005 to 1% of at least one kind selected from Nb Mo, V, W, Ti, Zr,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: INABA MICHIHIKO, NAKAMURA SHINICHI, KAGAMI HIDEYO, TEJIMA KOICHI
Format: Patent
Sprache:eng
Schlagworte:
ALLOYS
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
SEMICONDUCTOR DEVICES
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a lead frame which does not embrittle by hydrogen when subjected to etching and a always has a high reliable function. SOLUTION: The lead frame consists of an alloy containing, by mass, 30 to 48% Ni, 0.005 to 1% of at least one kind selected from Nb Mo, V, W, Ti, Zr, Cr and B, 0.003 to 0.02% carbon, ≤50 ppm oxygen, and ≤10 ppm hydrogen, and the balance Fe with inevitable impurities. A part of at least one kind selected from Nb, Mo, V, W, Ti, Zr, Cr and B is made into carbide, or the contained concentration thereof in the surface side is increased. COPYRIGHT: (C)2003,JPO