PROCESS FOR MANUFACTURING LARGE CERAMIC SUBSTRATE

PROBLEM TO BE SOLVED: To efficiently perform baking of a large ceramic substrate while inhibiting cracks accompanying baking, and to improve the yield. SOLUTION: Non-baked large ceramic substrates, especially non-baked large piezoelectric porcelain substrates containing components such as Pb, Bi, et...

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Bibliographische Detailangaben
Hauptverfasser: SHIKAUCHI SHINICHI, NIWA YASUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To efficiently perform baking of a large ceramic substrate while inhibiting cracks accompanying baking, and to improve the yield. SOLUTION: Non-baked large ceramic substrates, especially non-baked large piezoelectric porcelain substrates containing components such as Pb, Bi, etc., that evaporate when baked at an elevated temperature, are sent flatly a sheet by a sheet into a first oven and subjected to binder-removing and pre-sintering at an oven temperature of ≥750°C and a peak temperature of 1050°C for a processing time of 4-5 hr. The substrate is subsequently sent into a second oven for final baking. COPYRIGHT: (C)2003,JPO