HEAT TREATMENT APPARATUS AND METHOD THEREFOR
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and method therefor which has a small thermal capacity, is suitable for quick temperature rise and fall, and is capable of effectively controlling the generation of particles without causing the unevenness of heating to an treatment object...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and method therefor which has a small thermal capacity, is suitable for quick temperature rise and fall, and is capable of effectively controlling the generation of particles without causing the unevenness of heating to an treatment object such as a silicon wafer. SOLUTION: The heat treatment apparatus comprises at least a heating furnace body 1 with its upper end opened, a heating means 4 provided at the wall surface of the heating furnace body and a reaction vessel 5 which is composed of a single tube and is accommodated in the heating furnace body. In this heat treatment apparatus, an exhaust pipe connecting portion 6 which is bent for connecting an exhaust pipe 7 to evacuate the inside of a reaction vessel is formed at the upper part of the reaction vessel, and a temperature control means 8 is provided around the exhaust pipe connecting portion 6 and the exhaust pipe 7. COPYRIGHT: (C)2003,JPO |
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