SEMICONDUCTOR MANUFACTURING APPARATUS

PROBLEM TO BE SOLVED: To prevent generation of particles during forced cooling period, using the cooled air. SOLUTION: An inner tube 12, where the upper end thereof is formed as a closed cylindrical shape, and an exhaust port 15 is also formed at the lower end thereof, is accommodated at the internal side of a process tube 11, a blow out port of a gas guide tube 21 for guiding a raw material gas or the like is allocated at the upper end portion of a processing chamber 13, and a blow out port of a nitrogen gas supply tube 20 is allocated at the upper end portion of a heat-shielding space 18 formed between the process tube 11 and the inner tube 12. Between the process tube 11 and a heat shielding cover 31, a cooled air path 41 is formed allowing the cooled air 40 to flow during the forced cooling period. Accordingly, since the cooled air will not come into contact with the inner tube during the forcible cooling period of the processing chamber, local generation of the temperature difference of the inner tube can be prevented, and generation of particles can also be prevented through the prevention of peeling of the deposited film from the internal circumferential surface of the inner tube. COPYRIGHT: (C)2003,JPO