SURFACE ACOUSTIC WAVE DEVICE AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device and its manufacturing method for reducing an insertion loss, superior in weather resistance, and for reducing the cost. SOLUTION: An interdigital electrode 1b is provided on a piezoelectric substrate 1a. A function film 4 composed of at...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a surface acoustic wave device and its manufacturing method for reducing an insertion loss, superior in weather resistance, and for reducing the cost. SOLUTION: An interdigital electrode 1b is provided on a piezoelectric substrate 1a. A function film 4 composed of at least one type selected from a silicon nitride film, a silicon oxide film, and an oxynitride film is formed on at least one part of the interdigital electrode 1b by an ECR sputtering method. COPYRIGHT: (C)2003,JPO |
|---|