METHOD OF VAPOR DEPOSITION ONTO FILM

PROBLEM TO BE SOLVED: To provide a method of vapor deposition onto a film by which, when melting a vapor-deposition material in the step of preparation for vapor deposition onto the film, the influence of heat and electrification attendant on heating for melting upon the film can be removed and, as...

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Bibliographische Detailangaben
Hauptverfasser: KANAZAWA HIROMICHI, NAKAYAMA MASAO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of vapor deposition onto a film by which, when melting a vapor-deposition material in the step of preparation for vapor deposition onto the film, the influence of heat and electrification attendant on heating for melting upon the film can be removed and, as a result, the heat affection and break of the film can be prevented and film loss can be reduced to an extent greater than heretofore and, accordingly, traveling of the film and also vapor deposition onto the film can be stably carried out. SOLUTION: In the method of vapor deposition onto the film, a thin film is deposited by vacuum deposition onto the long-size film 2 composed of aromatic polyamide. During the melting of the vapor-deposition material, the long- size film 2 is allowed to remain stationary or to travel at an ultralow speed of ≤1 m/min in a state where a shutter 9 between the vapor-deposition material and the long-size film 2 is closed. When the melting of the vapor-deposition material is completed, the final traveling of the long-size film 2 is started, and simultaneously or after that, the shutter 9 is opened. COPYRIGHT: (C)2003,JPO