OLEFIN BASED LAPPING FILM

PROBLEM TO BE SOLVED: To provide an olefin based lapping film which is excellent in formability, transparency, heat sealing property, elongation, aptitude for packaging machine and the like. SOLUTION: A substrate layer is a resin composition composed of one kind to be selected from 10-40 wt.% of (A)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IYA TAKESHI, SUGIMOTO HIDEMASA, SAKANO HIROSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an olefin based lapping film which is excellent in formability, transparency, heat sealing property, elongation, aptitude for packaging machine and the like. SOLUTION: A substrate layer is a resin composition composed of one kind to be selected from 10-40 wt.% of (A) a polypropylene based resin of 100,000 to 500,000 in a molecular weight wherein a resin elution amount by a cross separation method is 10 to 50 wt.% at ≤10°C, 5 to 45 wt.% at 10°C to 65°C, 1 to 18 wt.% at 65°C to 90°C and 40 to 80 wt.% at 90°C to 125°C to total polypropylene based resin; 20 to 60 wt.% of (B) a polyethylene and/or ethylene-α-olefin copolymer; and 10 to 40 wt.% of (C) a petroleum resin and hydrogen added derivatives thereof. A layer containing an ethylene-vinyl acetate copolymer of 0.2 to 10 in MFR and/or an ethylene-α-olefin copolymer are laminated on a side surface of the substrate layer to obtain the olefin based lapping film. COPYRIGHT: (C)2003,JPO