METHOD OF MANUFACTURING ELECTRONIC PACKAGE

METHOD OF MANUFACTURING ELECTRONIC PACKAGE

PROBLEM TO BE SOLVED: To solve the problem that initial resistance may vary greatly and sufficient connecting reliability may not be ensured in electronic components packaging using a conductive adhesive. SOLUTION: Ultrasonic wave is applied to the portions of the conductive adhesive 3 before or whe...

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Bibliographische Detailangaben
Hauptverfasser: KITAE TAKASHI, TAKEZAWA HIROTERU, NISHIYAMA TOSAKU, SOGO HIROSHI, ISHIMARU YUKIHIRO, KOBAYASHI SHINJI
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Zusammenfassung:PROBLEM TO BE SOLVED: To solve the problem that initial resistance may vary greatly and sufficient connecting reliability may not be ensured in electronic components packaging using a conductive adhesive. SOLUTION: Ultrasonic wave is applied to the portions of the conductive adhesive 3 before or when the conductive adhesive 3 cures. This enables increasing the filling density of conductive fillers and improving the contact probability of the conductive fillers. COPYRIGHT: (C)2003,JPO