INFRARED RAY DETECTION ARRAY AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide an infrared ray detection array including an infrared ray detector that can correct a support angle at a heat-insulating structure section. SOLUTION: In the infrared ray detection array where a plurality of infrared ray detectors are arranged in a matrix on a substra...

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Bibliographische Detailangaben
Hauptverfasser:	KANEDA OSAMU, SONE TAKANORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an infrared ray detection array including an infrared ray detector that can correct a support angle at a heat-insulating structure section. SOLUTION: In the infrared ray detection array where a plurality of infrared ray detectors are arranged in a matrix on a substrate, the infrared ray detector includes a support leg that has one end fixed to a substrate and a lamination structure of an insulating layer and a wiring layer, and a heat-insulating structure section that is supported by the support leg and has the insulating layer having a first surface set to be the incidence side of an infrared ray and a second surface set to be the incidence side of read light, a reflection film that is formed on the second surface of the insulating film, and a resistor that is connected to the wiring layer, and changes the reflection direction of the read light that enters the reflection film by reversibly bending the support leg that is heated to a detection temperature by the infrared ray. The resistor is energized via the wiring layer, and the support leg is heated to a temperature being higher than the detection temperature, thus reversibly bending the support leg. COPYRIGHT: (C)2003,JPO