ELECTROMAGNETIC-SHIELDING STRUCTURE BACKING

PROBLEM TO BE SOLVED: To solve the problem that a material cost is increased in an electromagnetic-shielding structure backing using a gypsum board having electromagnetic-shielding performance and a construction cost is increased in the electromagnetic-shielding structure backing using copper foil....

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Bibliographische Detailangaben
Hauptverfasser:	TOGAMI IKUHIDE, NONAKA SUGURU, HASEGAWA KIYOMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BUILDING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEILINGS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS ROOFS WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve the problem that a material cost is increased in an electromagnetic-shielding structure backing using a gypsum board having electromagnetic-shielding performance and a construction cost is increased in the electromagnetic-shielding structure backing using copper foil. SOLUTION: In the electromagnetic-shielding structure backing, the end sections 1a, 1a and the like of a plurality of conductive meshes 1, 1 and the like installed on the surface side of an interior-finishing backing are superposed mutually, and the conductive meshes 1, 1 and the like in the superposing sections 7 are joined mutually. The conductive meshes 1, 1 and the like in the joining sections 7 are joined mutually by a pushing by boards mounted on the surface sides of the superposing sections 7 by a fixing means such as a screw. COPYRIGHT: (C)2003,JPO