SEALING COMPOSITION AND SEALED STRUCTURE

PROBLEM TO BE SOLVED: To provide an epoxy resin-based sealing composition that is required to have excellent heat resistance and air-tightness for producing display elements. SOLUTION: The resin composition for sealing comprises (a) an alicyclic ring-bearing epoxy resin, (b) an aromatic epoxy resin,...

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Bibliographische Detailangaben
Hauptverfasser:	KUMAI YUTAKA, SUEZAKI MIZUHO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin-based sealing composition that is required to have excellent heat resistance and air-tightness for producing display elements. SOLUTION: The resin composition for sealing comprises (a) an alicyclic ring-bearing epoxy resin, (b) an aromatic epoxy resin, (c) an amine-based curing agent, (d) a spherical inorganic particle spacer and (e) inorganic particles having average particle size of 1-10 μm. The composition is used for sealing a couple of substrates opposing to each other with a prescribed interval. COPYRIGHT: (C)2003,JPO