POLYIMIDE PRECURSOR COMPOSITION

PROBLEM TO BE SOLVED: To provide a polyimide precursor composition that does not produce a difference in a linear expansion coefficient of a polyimide produced after heat treatment between a non-photosensitive polyimide and a photosensitive polyimide. SOLUTION: The polyimide precursor composition is...

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Hauptverfasser:	SUZUE SHIGERU, FUJIMOTO KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyimide precursor composition that does not produce a difference in a linear expansion coefficient of a polyimide produced after heat treatment between a non-photosensitive polyimide and a photosensitive polyimide. SOLUTION: The polyimide precursor composition is a polyimide precursor composition which produces a polyimide wherein both a polyimide A produced by heat treatment of the polyimide precursor composition and a polyimide B produced by heat treatment of a photosensitive polyimide precursor composition prepared by imparting photosensitivity to the polyimide precursor composition have an average linear expansion coefficient at 30°C-100°C in the range of 5×10-6/°C to 25×10-6/°C and the absolute value of a difference in a linear expansion coefficient between the polyimide A and the polyimide B is within 2×10-6/°C. COPYRIGHT: (C)2003,JPO