PRINTED WIRING BOARD PAD

PROBLEM TO BE SOLVED: To provide a printed wiring board pad which is capable of protecting a printed wiring board against deformation caused by a printing pressure at printing or a pressure applied when a component is mounted and of mounting electronic components well on the printed wiring board thr...

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Bibliographische Detailangaben
Hauptverfasser:	TERAMOTO TOSHIO, KURIHASHI YUKIO, CHIBA HIDEKI, SHIMOYAMA TADASHI, SHIMADA YASUHIKO, YOSHIHARA TOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed wiring board pad which is capable of protecting a printed wiring board against deformation caused by a printing pressure at printing or a pressure applied when a component is mounted and of mounting electronic components well on the printed wiring board through a method, wherein a printed board is brought into full contact with the pad and fixed even if the wiring board is partially warped when cream solder used for mounting electronic components is printed on the rear of the printed wiring board or the electronic components are mounted on the rear of the printed wiring board. SOLUTION: This printed wiring board pad is optically molded, has a compressive modulus of elasticity 50 to 3000 kg/cm2, and is provided with a main surface which bears against a printed wiring board and has a height accuracy of 0.2 mm or below. COPYRIGHT: (C)2003,JPO