METHOD AND DEVICE FOR MOUNTING PART

PROBLEM TO BE SOLVED: To provide part mounting method and device where repetition of image signal transfer for each electronic part is not necessary and electronic part measuring time is shortened. SOLUTION: A moving head 31 provided with a plurality of suction nozzles 37 arranged in parallel and an...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KANETAKA IWAO, OGURA KANKI, NOUDO AKIRA, YANAIKE SEISHIROU, HACHITANI EIICHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide part mounting method and device where repetition of image signal transfer for each electronic part is not necessary and electronic part measuring time is shortened. SOLUTION: A moving head 31 provided with a plurality of suction nozzles 37 arranged in parallel and an image pickup device 71 are relatively moved in the parallel arrangement direction of the nozzles 37, the image of each part 73 sucked and held by the respective nozzle 37 is picked up, the sucked states of the parts 73 to the nozzles 37 are recognized by the photographed images, and the parts 73 are mounted on a circuit board while correcting the packaging directions and packaging positions of the parts 73 based on the recognized results. In this case, the image pickup device 71 moves relatively to the head 31 while maintaining an exposure available state, irradiates each of the parts 73 sucked and held by the nozzles 37 at prescribed timing when each part 73 passes the image pickup device and the images of these parts 73 are collected on one picture by the irradiation of light to obtain picked-up images. COPYRIGHT: (C)2003,JPO