PACKAGE FOR STORING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To solve the problem that heat generated during the operation of a semiconductor device cannot be efficiently dissipated outside, which causes a thermal destruction of the semiconductor device. SOLUTION: A package for storing a semiconductor device comprises a base material 1, a frame-like insulator 2 provided with a wiring layer 6, and a cover body 3. The frame-like insulator 2 is formed of crystalline glass which consists of 40 to 46 wt.% of silicon oxide, 25 to 30 wt.% of alumina, 8 to 13 wt.% of magnesium oxide, 6 to 9 wt.% of zinc oxide, and 8 to 11 wt.% of boron oxide, while the base material 1 consists of 55 to 90 wt.% of silicon carbide and 10 to 45 wt.% of copper. COPYRIGHT: (C)2003,JPO