METHOD OF VACUUM-DRYING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of vacuum-drying substrate by which not only the moisture adhering to the surface of a substrate but also the moisture infiltrated into an element forming film can be removed in a short time without deforming nor modifying an element formed on the substrate...

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Bibliographische Detailangaben
Hauptverfasser:	HARANO RIICHIRO, WATARI TORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEATING LIGHTING MECHANICAL ENGINEERING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of vacuum-drying substrate by which not only the moisture adhering to the surface of a substrate but also the moisture infiltrated into an element forming film can be removed in a short time without deforming nor modifying an element formed on the substrate at drying time. SOLUTION: In this method of vacuum-drying substrate, the substrate W is cleaned with a cleaning fluid and the cleaned substrate W is dried, after the surface of the substrate W is treated to a desired state. This method includes a step of desorbing the moisture adhered to the surface of the substrate W by vaporizing the moisture to the outside as steam by heating 38 the surface of the substrate to a prescribed temperature and another step of removing the desorbed steam from the substrate W by performing evacuation 40 at a prescribed degree of vacuum. COPYRIGHT: (C)2003,JPO