MICRO COOLING DEVICE
PROBLEM TO BE SOLVED: To provide a micro cooling device that has a simple structure and can be reduced in manufacturing cost. SOLUTION: This micro cooling device is provided with a substrate which comes into contact with a heat source by a prescribed area of its lower surface, a microchannel array f...
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| creator | KO TEISO CHO KYUNG-IL KIM TAE-KYUN |
| description | PROBLEM TO BE SOLVED: To provide a micro cooling device that has a simple structure and can be reduced in manufacturing cost. SOLUTION: This micro cooling device is provided with a substrate which comes into contact with a heat source by a prescribed area of its lower surface, a microchannel array formed on the substrate and having a coolant concentrating section in which a coolant flows on the opposite side of the prescribed area of the lower surface of the substrate, and a condensing means which fixes the microchannel array, condenses the steam generated while the heat source is cooled, and makes the condensed steam to flow in the microchannel array. |
| format | Patent |
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SOLUTION: This micro cooling device is provided with a substrate which comes into contact with a heat source by a prescribed area of its lower surface, a microchannel array formed on the substrate and having a coolant concentrating section in which a coolant flows on the opposite side of the prescribed area of the lower surface of the substrate, and a condensing means which fixes the microchannel array, condenses the steam generated while the heat source is cooled, and makes the condensed steam to flow in the microchannel array.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COLD ROOMS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; HEAT PUMP SYSTEMS ; HEATING ; ICE-BOXES ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; REFRIGERATION OR COOLING ; REFRIGERATORS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS ; WEAPONS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030530&DB=EPODOC&CC=JP&NR=2003158230A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030530&DB=EPODOC&CC=JP&NR=2003158230A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KO TEISO</creatorcontrib><creatorcontrib>CHO KYUNG-IL</creatorcontrib><creatorcontrib>KIM TAE-KYUN</creatorcontrib><title>MICRO COOLING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a micro cooling device that has a simple structure and can be reduced in manufacturing cost. 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SOLUTION: This micro cooling device is provided with a substrate which comes into contact with a heat source by a prescribed area of its lower surface, a microchannel array formed on the substrate and having a coolant concentrating section in which a coolant flows on the opposite side of the prescribed area of the lower surface of the substrate, and a condensing means which fixes the microchannel array, condenses the steam generated while the heat source is cooled, and makes the condensed steam to flow in the microchannel array.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEAT PUMP SYSTEMS HEATING ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PRINTED CIRCUITS REFRIGERATION OR COOLING REFRIGERATORS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS WEAPONS |
| title | MICRO COOLING DEVICE |
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