MICRO COOLING DEVICE

PROBLEM TO BE SOLVED: To provide a micro cooling device that has a simple structure and can be reduced in manufacturing cost. SOLUTION: This micro cooling device is provided with a substrate which comes into contact with a heat source by a prescribed area of its lower surface, a microchannel array f...

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Bibliographische Detailangaben
Hauptverfasser: KO TEISO, CHO KYUNG-IL, KIM TAE-KYUN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a micro cooling device that has a simple structure and can be reduced in manufacturing cost. SOLUTION: This micro cooling device is provided with a substrate which comes into contact with a heat source by a prescribed area of its lower surface, a microchannel array formed on the substrate and having a coolant concentrating section in which a coolant flows on the opposite side of the prescribed area of the lower surface of the substrate, and a condensing means which fixes the microchannel array, condenses the steam generated while the heat source is cooled, and makes the condensed steam to flow in the microchannel array.