HEAT-RESISTANT RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition as a good protective film or insulation film satisfying heat resistance, adhesion and flexibility. SOLUTION: A heat-resistant film having excellent water resistance and solvent resistance can be obtained by forming a mechanically ex...

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Bibliographische Detailangaben
Hauptverfasser:	UEMITSU TATSUYOSHI, MATSUDA MASAKI, NAKANO TSUNETOMO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition as a good protective film or insulation film satisfying heat resistance, adhesion and flexibility. SOLUTION: A heat-resistant film having excellent water resistance and solvent resistance can be obtained by forming a mechanically excellent film by reacting (A) an organic solvent-soluble polyimide having an acid group with (B) a heat-resistant epoxy resin to form a three-dimensional net structure, and acetalizing the hydroxy group caused by the reaction with (C) a vinyl ether compound having the high melting point to reduce the polarity of the film.