METHOD FOR MANUFACTURING MOUNTED STRUCTURE

PROBLEM TO BE SOLVED: To solve the problem that, in a conventional method for manufacturing a mounted structure which needs to process an internal surface of a through hole of a high polymer film, in order not to form a processing layer such as a metal film or a flux layer on the surface except the internal surface of the through hole of the high polymer film, a step of protecting the surface with a resist, or the like by use of a photo step is necessitated and as a result, a great number of steps are necessary. SOLUTION: After a protection film is adhered to both surfaces of a high polymer film, a through hole is formed in the high polymer film together with this protection film at a location corresponding to an IC joining terminal, or a printed circuit substrate terminal. A surface processing such as a metal film coating or a flux coating is performed from on the protection film, and thereafter the protection film is separated.