CONDUCTIVE PASTE AND METHOD OF MANUFACTURING CERAMIC CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a conductive paste for forming a circuit pattern, free from clogging in a screen, fine, thick and almost preventive of bleeding, using a screen printing method for conveniently forming the circuit pattern, and a method of manufacturing a ceramic circuit board. SOLUTI...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAZAWA HIDEJI, MATSUMOTO YUZURU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive paste for forming a circuit pattern, free from clogging in a screen, fine, thick and almost preventive of bleeding, using a screen printing method for conveniently forming the circuit pattern, and a method of manufacturing a ceramic circuit board. SOLUTION: The conductive paste comprises a conductive metal powder, an organic binder, an organic solvent, a thixotropic agent for increasing the ratio of paste viscosity during high shearing stress to that during low shearing stress, and a surface active agent. The thixotropic agent is of at least one type selected from fatty amide wax, fine powder silica and organic bentonite, and the content of the thixotropic agent is 0.5-2 pts.mass in terms of that of the 100 pts.mass conductive metal powder.