SURFACE ACOUSTIC WAVE DEVICE

PROBLEM TO BE SOLVED: To reduce distortion to be given to a surface acoustic wave chip in a surface acoustic wave device where the surface acoustic wave chip is die-bonded onto the inner bottom surface of a box shape case and the upper end of the box shape case is sealed with a cover. SOLUTION: At l...

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Bibliographische Detailangaben
1. Verfasser:	TSURUTA AKIZO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce distortion to be given to a surface acoustic wave chip in a surface acoustic wave device where the surface acoustic wave chip is die-bonded onto the inner bottom surface of a box shape case and the upper end of the box shape case is sealed with a cover. SOLUTION: At least in a propagation direction of the surface acoustic wave of the surface acoustic wave chip, the length of an adhering surface of a die-bond adhesive for die-bonding the surface acoustic wave chip is set at a level not to be larger than the length of the surface acoustic wave chip or a level to die-bond the chip with the die-bond adhesive by preventing a fillet from existing on the end surface of the chip. Then the distortion to be given to the chip is reduced, a frequency characteristic is made to be stable in the device and, then, a yield of a product is enhanced.