FILM DEPOSITION APPARATUS

PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for depositing a thin film on a substrate surface. SOLUTION: This film deposition apparatus comprises an introduction pipe for continuously feeding a wire-like or granular material together with a gas, an induction heating unit co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA TAKAHARU, KITAHATA AKIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for depositing a thin film on a substrate surface. SOLUTION: This film deposition apparatus comprises an introduction pipe for continuously feeding a wire-like or granular material together with a gas, an induction heating unit comprising a cylindrical insulator in which a tip side of the introduction pipe is inserted from one side, a heating coil is wound around the entire outer circumference, and a heater is provided inside, and an ionizing unit comprising a second cylindrical insulator in which one end side thereof is brought into contact with or close to the induction heating unit, and a high frequency coil is wound around the outer circumference thereof.