METHOD FOR MANUFACTURING WIRING BOARD
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method capable of suppressing warp in the case of collectively manufacturing a plurality of wiring boards and then individually dividing into respective wiring boards. SOLUTION: The method for manufacturing wiring boards 101 is provided w...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method capable of suppressing warp in the case of collectively manufacturing a plurality of wiring boards and then individually dividing into respective wiring boards. SOLUTION: The method for manufacturing wiring boards 101 is provided with a core board arrangement process for arranging a plurality of core boards 111 in a storage part 175, in a working jig 171 having a jig surface 172 and the storage part 175 opened on the jig surface 172 and capable of storing these core boards 111 so as to align the jig surface 112 with respective core surfaces 112; and a 1st insulating layer forming process for forming a 1st resin insulating layer 131 so as to cover the jig surface 172 and respective core surfaces 112. |
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