METHOD OF FORMING THROUGH WIRING AND METAL FILLING METHOD

PROBLEM TO BE SOLVED: To provide a technique of filling an entire through-hole with metal closely when through wiring is formed on a silicon board. SOLUTION: When a board 10 is dipped into molten metal melted by heating so as to fill a through-hole 11 bored in the board 10 with the molten metal, a c...

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Bibliographische Detailangaben
Hauptverfasser:	SUEMASU TATSUO, TAKIZAWA ISAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technique of filling an entire through-hole with metal closely when through wiring is formed on a silicon board. SOLUTION: When a board 10 is dipped into molten metal melted by heating so as to fill a through-hole 11 bored in the board 10 with the molten metal, a communicating hole 16 is provided to a sacrifice layer 15a formed on at least the one surface 13 of the board 10 while penetrating through the sacrifice layer 15a and communicating with the through-hole 11 bored in the board 10. Even if the molten metal 20 flows out of the through-hole 11 when the board 10 is pulled up from the molten metal, the molten metal residing inside the communicating hole 16 is capable of making up for the above outflow of the molten metal from the through-hole 11.