SUBSTRATE WITH CONDUCTIVE BALLS ARRANGED THEREON, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a substrate with balls arranged thereon, and a semiconductor device using the same, capable of high yield conductive ball transcription, even when gaps become narrower between external connection terminals or conductive balls become smaller. SOLUTION: This light-transmitting substrate with one of its surfaces being coated with a UV-setting adhesive, and with the adhesive surface carrying conductive balls transfer arranged in advance, to correspond to positions of semiconductor device conductive terminals. Using this substrate, high yield conductive ball transfer is carried out, even when the gaps between external connection terminals become narrower and conductive balls become smaller. A method for manufacturing semiconductor devices using the same is also provided.